氮化铝陶瓷材料

氮化铝陶瓷材料具有优良的导热性能和电绝缘性能，接近于硅的热膨胀系数，低介电常数，耐腐蚀性和高温下的化学稳定性。被广泛应用于大规模集成电路基板及封装材料。

本公司选用高纯超细铝粉，采用自蔓延方法制取的氮化铝粉体，经超细加工后用于生产BAT陶瓷产品及电子器件。

Aluminum nitride materials have very nice electrical resistivity and low dielectric constant and its thermal expansion coefficient closely matches that of silicon.It is stable in hign temperature and corrosion resistance and it is used widely as the plate of integrated circuit and sealing materials.It is also used as the main material for the manufacturing of BAT cermics. We produce our ALN powder with aluminum powder in super quality with a spread method and after extra grinding,ALN powder is obtained.